Weekly Electronics Tech Roundup : 13 September 2026

The week ending 13 September 2026 brought several developments directly relevant to power-electronics and embedded-system designers. The strongest themes were higher-voltage DC power architectures for AI data centers, integrated power and functional safety for EV traction inverters, higher-density 600 V MOSFET packaging, new CCM PFC control, high-power three-phase DC supplies, high-density high-voltage MLCCs, and new 64-bit MPUs for edge systems.

This roundup focuses on developments announced or materially updated from 7 to 13 September 2026. Previously covered items are avoided where practical. Some entries are product launches while others are important availability or system-level technology milestones.

1. Infineon TLE9744QK Integrates Power Management and ASIL-D Safety for EV Traction Inverters

Infineon introduced the OPTIREG TLE9744QK, an application-specific power-management IC aimed at high-voltage traction-inverter ECUs in hybrid and electric vehicles. It combines multiple power-supply functions, resolver excitation and an independent safety engine in one package.

The IC integrates two buck-boost pre-regulators, linear regulators, sensor trackers, monitoring functions, watchdogs and safety control. It also includes an integrated resolver exciter. Infineon states that this architecture can reduce PCB area by up to 70 percent for the replaced devices. The operating-voltage range is 4 V to 36 V and the operating temperature range is -40 °C to +150 °C. It is offered in a PG-LQFP-64 package and targets ISO 26262-compliant systems up to ASIL-D.

Engineer’s perspective: This is significant because the power tree becomes part of the functional-safety architecture. Integrating redundant monitoring and safety functions can reduce external failure points and simplify the overall ECU design.

Announcement date: 8 September 2026

2. AOS Launches 600 V αMOS E2 Super-Junction MOSFETs with Top-Side Cooling

Alpha and Omega Semiconductor introduced AOGT037V60DE2 and AOGT060V60DE2, 600 V αMOS E2 Super-Junction MOSFETs rated at 37 mΩ and 60 mΩ respectively. They use AOS’s GTPAK top-side-cooled package.

The devices target AC/DC power supplies, DC/DC converters, solar inverters and other high-voltage switching applications. AOS identifies boost PFC, totem-pole PFC slow legs, LLC, phase-shifted full bridge and cycloconverters among the intended applications. The package approach provides a more direct thermal path to a heatsink or cold plate while leaving the PCB underneath.

Engineer’s perspective: At higher switching frequencies, package inductance, switching loss, body-diode behaviour and thermal resistance can be as important as RDS(on). Top-side cooling is therefore a system-level advantage, not merely a package feature.

Announcement date: 8 September 2026

3. STMicroelectronics L4983 CCM PFC Controller Enters Production

STMicroelectronics brought the L4983 family of continuous-conduction-mode PFC controllers into production for power supplies ranging from several hundred watts to several kilowatts. L4983A operates at 65 kHz and L4983B at 130 kHz.

The controller uses a multiplier emulator and distortion-optimization circuitry, and includes a totem-pole output stage with approximately 3 A source and 7 A sink capability. Protection includes overvoltage, cycle-by-cycle overcurrent, inductor-saturation detection, feedback supervision and soft-start. ST’s EVL4983-350W evaluation board implements a universal-input 350 W PFC pre-regulator with a regulated 400 VDC output and reported peak efficiency of 97.4%.

Engineer’s perspective: 130 kHz can reduce magnetic size, but switching loss and EMI increase. Frequency should therefore be selected from the complete loss, thermal and EMI design rather than simply choosing the higher value.

Announcement date: 9–10 September 2026

4. TDK-Lambda Introduces 12.5 kW Three-Phase 385 VDC Power Supplies

TDK-Lambda introduced the TPF12500-385 series of non-isolated three-phase power supplies. They provide 12.5 kW nominal output and up to 13.1 kW, with a regulated 385 VDC output and typical efficiency of 97.5%. The input range is 360–528 VAC in Delta or Wye configuration.

Applications include semiconductor manufacturing equipment, data centers, RF radar power amplifiers, industrial automation and test equipment. Two units can be paralleled using droop-mode current sharing. At 12.5 kW, the ideal output current at 385 V is about 32.5 A; at 48 V it would be about 260 A.

Engineer’s perspective: High-voltage intermediate buses dramatically reduce distribution current, enabling smaller conductors and lower I²R losses. This is one reason higher-voltage DC architectures are becoming attractive in high-power systems.

Announcement date: 10 September 2026

5. TDK Introduces 10 µF, 100 V X7R MLCC in 3225 Package

TDK announced a 10 µF, 100 V X7R soft-termination multilayer ceramic capacitor in a 3225 package, targeting AI servers, humanoid robots and xEV applications. Soft termination improves resistance to board-flex and mechanical stress.

The nominal 10 µF value should not be treated as the effective capacitance under all conditions. DC bias, temperature and frequency can substantially reduce usable capacitance. The component is therefore particularly interesting for local high-frequency decoupling and compact power-stage filtering.

Engineer’s perspective: On a 48 V-class bus, a 100 V rating provides useful voltage margin, but DC-bias curves, ripple current and transient conditions must still be checked.

Announcement date: 8 September 2026

6. Renesas RZ/G3L and RZ/G3SE 64-bit MPUs Target HMI and IoT Edge Systems

Renesas expanded its RZ/G family with the RZ/G3L and RZ/G3SE 64-bit general-purpose MPUs for industrial and consumer HMI, IoT gateways and connected edge systems. The RZ/G3L integrates a GPU and H.264 video codec, while the RZ/G3SE is aimed at applications with more basic display requirements, including EV chargers and industrial gateways.

For modern power-electronics products, the MPU can handle Linux-class HMI, networking, cloud connectivity and data logging while a deterministic MCU or dedicated controller performs PWM generation, ADC sampling, current-loop control and fast protection.

Engineer’s perspective: Separating high-level software from hard real-time power control can make the architecture easier to validate and protect. The MPU does not need to sit inside the fastest control loop simply because it has more processing capability.

Announcement date: 10 September 2026

7. Infineon and SolarEdge Advance 800 VDC Solid-State Protection for AI Data Centers

Infineon and SolarEdge expanded their collaboration toward solid-state circuit breakers for 800 VDC distribution in AI and hyperscale data centers. SolarEdge is developing the SSCB architecture while Infineon contributes CoolSiC JFET technology.

The objective is microsecond-scale DC fault isolation. Unlike AC, DC does not naturally pass through a current-zero point, so semiconductor-based interruption can provide much faster controlled fault isolation. The development is important as AI infrastructure moves toward higher-voltage DC architectures to reduce distribution current and improve power density.

Engineer’s perspective: An 800 VDC architecture must be evaluated as a complete protection system. Fault detection speed, current sensing, semiconductor SOA, stray inductance, gate-drive response, thermal stress and protection selectivity all become critical.

Announcement date: 9 September 2026

Engineer’s Weekly Takeaway

The dominant theme this week is the movement from individual semiconductor improvements toward complete power architectures. Infineon integrates power and safety at the traction-inverter controller level; ST integrates more PFC control and protection; AOS addresses thermal management at the MOSFET package level; TDK is pushing higher-voltage DC distribution and higher-density passives; and the Infineon–SolarEdge work shows that high-voltage DC distribution also requires a new approach to fault protection.

For engineers working on EV chargers, UPS systems, solar inverters, industrial SMPS and high-power DC systems, the practical message is that efficiency is increasingly a system-level problem. Device selection, switching frequency, thermal path, EMI, protection, control-loop behaviour and functional safety must be optimized together.