Vishay Launches Four 650 V Superjunction MOSFET Power Modules
Vishay Intertechnology has introduced four new 650 V superjunction MOSFET power modules aimed at high-efficiency industrial power-conversion applications. The new devices combine Vishay's latest 650 V superjunction MOSFET technology with the established SOT-227 power-module package, providing designers with high current capability while maintaining a familiar mechanical and electrical interface.
The four new
devices are:
- VS-FC50SA65
- VS-FC100SA65
- VS-FC150SA65
- VS-FC50LA65
Three of the
devices are single-switch MOSFET modules with nominal current ratings of 50
A, 100 A and 150 A, while the VS-FC50LA65 is a 50 A low-side chopper
module incorporating a 650 V SiC diode.
Vishay
announced the devices on 1 October 2026, describing them as a way to
improve power-conversion efficiency through an optimized trade-off between
MOSFET on-resistance and gate charge while allowing designers to use the
familiar SOT-227 mechanical format.
These devices
are particularly relevant to engineers working on DC/DC converters, DC/AC
inverters, solar inverters, EV charging equipment, UPS systems, industrial
power supplies, welding equipment, rail power systems and high-voltage DC
infrastructure.
New
Vishay 650 V MOSFET Module Family
The basic
specifications of the four devices are summarized below.
|
Device |
Configuration |
Voltage |
Current |
Typical
RDS(on) |
Gate
Charge |
|
VS-FC50SA65 |
Single switch |
650 V |
50 A |
44 mΩ |
167 nC |
|
VS-FC100SA65 |
Single switch |
650 V |
100 A |
22 mΩ |
338 nC |
|
VS-FC150SA65 |
Single switch |
650 V |
150 A |
14.8 mΩ |
508 nC |
|
VS-FC50LA65 |
Low-side
chopper + SiC diode |
650 V |
50 A |
45 mΩ |
167 nC |
All four
devices have a specified operating junction-temperature range of −55°C to
+150°C. Vishay states that samples and production quantities are available,
with a stated lead time of 12 weeks.
The most
important design feature is the balance between RDS(on) and Qg.
This is
important because simply reducing MOSFET resistance is not enough for a
high-frequency converter. Lower RDS(on) reduces conduction losses, but
increasing silicon area can increase gate charge and therefore switching
losses. The designer therefore has to find a practical balance.
How
These Modules Compare Conceptually with SiC MOSFETs
The arrival of new 650 V superjunction MOSFETs does not mean silicon MOSFETs are competing directly against SiC MOSFETs in every application. Instead, the choice depends heavily on the switching conditions.
A simplified
comparison is:
|
Parameter |
650 V
Superjunction MOSFET |
650/750 V
SiC MOSFET |
|
Material |
Silicon |
Silicon
carbide |
|
Cost |
Generally
lower |
Generally
higher |
|
Conduction
loss |
Very
competitive |
Very
competitive |
|
Switching
speed |
Good |
Excellent |
|
Reverse
recovery |
Body-diode
dependent |
Very low
reverse recovery |
|
High-frequency
operation |
Good |
Excellent |
|
High-temperature
performance |
Good |
Excellent |
|
Typical
advantage |
Cost/performance |
High
efficiency/high frequency |
For moderate switching frequencies, a superjunction MOSFET can be extremely competitive.For very high-frequency hard switching, the low switching losses and superior diode characteristics of SiC can justify the additional cost. The designer therefore needs to calculate total system loss, not simply compare RDS(on).
15. Why This
Vishay Launch Is Important
The significance of these devices is not simply that Vishay has introduced another 650 V MOSFET. The more important point is that Vishay is combining:
- 650 V superjunction technology
- high-current module construction
- optimized RDS(on)-Qg characteristics
- SOT-227 compatibility
This makes the devices attractive for engineers who want to improve the efficiency of existing industrial equipment without completely redesigning the power stage. The product range also provides a useful progression:
50 A → 100 A
→ 150 A
with
progressively lower typical RDS(on):
44 mΩ → 22
mΩ → 14.8 mΩ
while the gate
charge increases:
167 nC → 338
nC → 508 nC
That progression itself demonstrates the fundamental engineering compromise between conduction performance and switching performance.

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